Hanster R-636POL 20ml Lead Free Soldering Flux Welding Paste Tin Cream For BGA IC Chip NAND Repair

Weakly active, environmental and lead-free welding flux paste
Ensures a leak-free bond and features fast drying
Strong welding capability, high insulativity and easy to clean
Suitable for mobile phones, digital products, precise instruments etc.
Squeezing style, easy to use
Size: 88 x 38mm
Volume: 20mL